Samsung develops 36GB HBM3E with 12 layers

Photos / 황석주 / 2024-02-27 11:49:18
  • facebook
  • twitter
  • kakao
  • naver
  • band


Samsung develops 36GB HBM3E with 12 layers

This image, provided by Samsung Electronics Co. on Feb. 27, 2024, shows its latest fifth generation high bandwidth memory (HBM) chips with 12 layers of DRAM chips, boasting the industry's largest capacity of 36 gigabytes. (PHOTO NOT FOR SALE) (Yonhap)

(END)

<저작권자(c) 연합뉴스, 무단 전재-재배포, AI 학습 및 활용 금지>

(C) Yonhap News Agency. All Rights Reserved

  • facebook
  • twitter
  • kakao
  • pinterest
  • naver
  • band

Most Popular

1

(LEAD) S. Korea capable of taking 'primary' responsibility to deter N.K. with 'critical, but more limited' U.S. support: NDS

2

(2nd LD) S. Korea capable of taking 'primary' responsibility to deter N.K. with 'critical, but more limited' U.S. support: NDS

3

Enhypen's Sunghoon to carry Olympic torch at 2026 Winter Olympics

4

(News Focus) New U.S. strategy signals USFK posture 'upgrade,' ups pressure on S. Korea to boost defense capabilities

5

Prosecutors seek arrest warrants for 72 online scam suspects repatriated from Cambodia

K-POP

K-DRAMA&FILM