LG Innotek to expand package solutions business

Cho Ji-tae, executive vice president and head of the package solution business unit at LG Innotek Co., attends a press conference at the headquarters of the electronic components arm of LG Group, in Seoul on June 16, 2026, in this photo released by the company. LG Innotek aims to significantly expand its package solutions business amid growing demand for semiconductor substrates driven by the artificial intelligence boom, Cho said. (PHOTO NOT FOR SALE) (Yonhap)

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